DocumentCode
1385959
Title
A Magnetic Tunnel Junction Based Zero Standby Leakage Current Retention Flip-Flop
Author
Ryu, Kyungho ; Kim, Jisu ; Jung, Jiwan ; Kim, Jung Pill ; Kang, Seung H. ; Jung, Seong-Ook
Author_Institution
Sch. of Electr. & Electron. Eng., Yonsei Univ., Seoul, South Korea
Volume
20
Issue
11
fYear
2012
Firstpage
2044
Lastpage
2053
Abstract
Recently, a magnetic tunnel junction (MTJ), which is a strong candidate as a next-generation memory element, has been used not only as a memory cell but also in spintronics logic because of its excellent properties of nonvolatility, no silicon area occupation, and CMOS process compatibility. One of the representative research areas for the spintronics logic is the zero standby leakage retention flip-flop. Conventional zero standby leakage retention flip-flops have several problems, including difficulty in design optimization among the C-Q delay, sensing current, and process variation tolerance, and the insufficient write current. In this paper, a new MTJ based retention flip-flop is presented to solve these problems. The proposed retention flip-flop is designed using industry-compatible 45-nm process technology model. The proposed retention flip-flop achieves a 41.58% reduced C-Q delay and a 67.53% lowered sensing current with a 1.06% increased area compared to the previous retention flip-flop.
Keywords
flip-flops; leakage currents; magnetic tunnelling; magnetoelectronics; C-Q delay; CMOS process compatibility; design optimization; industry-compatible process technology model; insufficient write current; magnetic tunnel junction; memory cell; next-generation memory element; nonvolatility; process variation tolerance; sensing current; silicon area occupation; size 45 nm; spintronics logic; zero standby leakage current retention flip-flop; Flip-flops; Magnetic tunneling; Magnetoelectronics; Memory architecture; magnetic tunnel junction (MTJ) logic; nonvolatile flip-flop; retention flip-flop; spintronics logic;
fLanguage
English
Journal_Title
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
Publisher
ieee
ISSN
1063-8210
Type
jour
DOI
10.1109/TVLSI.2011.2172644
Filename
6093717
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