DocumentCode :
1386357
Title :
Analysis of Thermal and Luminous Performance of MR-16 LED Lighting Module
Author :
Chi, Wei-Hao ; Chou, Tsung-Lin ; Han, Cheng-Nan ; Yang, Shin-Yueh ; Chiang, Kuo-Ning
Author_Institution :
Dept. of Power Mech. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Volume :
33
Issue :
4
fYear :
2010
Firstpage :
713
Lastpage :
721
Abstract :
Light emitting diode (LED) with a long lifetime, low power consumption, and low pollution has been successfully applied in many products. However, due to its low electro-optical conversion efficiency, high percentage of input power transformed to redundant heat, thus increasing the LED temperature. This phenomenon decreases the luminous flux, changing light color, and useful life span of LED. Therefore, thermal management becomes an important issue in high power LED. In this paper, the variation of luminous flux and light color for different LED lighting modules under long time operation has been measured and discussed. In addition, a detailed finite element model of LED lighting module, MR-16, with a corresponding input power and suitable boundary conditions is established by using the ANSYS finite element analysis program. Furthermore, to validate the simulation results, the current-voltage-temperature method for characterization of a diode is utilized to measure the junction temperature of LED chip indirectly and compare with simulation results. After the simulation is validated, various thermal performance assessments under the different design parameters of the LED package and lighting module are also investigated in this paper. The methodology and analysis results of this paper can provide a guideline for the LED lighting module such as MR-16 design in the future.
Keywords :
LED lamps; finite element analysis; thermal management (packaging); ANSYS finite element model; LED lighting module; LED temperature; electro-optical conversion efficiency; junction temperature; light color; luminous Performance; luminous flux; thermal Performance; thermal management; Finite element methods; Junctions; Light emitting diodes; Lighting; Semiconductor device measurement; Temperature measurement; Thermal management; Finite element analysis; light emitting diode; light emitting diode (LED) lighting module; thermal management;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2010.2073469
Filename :
5643114
Link To Document :
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