Title :
UTCP: A Novel Polyimide-Based Ultra-Thin Chip Packaging Technology
Author :
Christiaens, W. ; Bosman, E. ; Vanfleteren, J.
Author_Institution :
Dept. of Electron. & Inf. Syst., Ghent Univ., Ghent, Belgium
Abstract :
Flexible materials, today, are being used already as base substrates for electronic assembly. A lot of mounted components could be integrated in flexible polyimide (PI) substrates. Very interesting advantages of integrating components into the flex are compactness and enhanced flexibility; not only the interconnection but also the components themselves can be mechanically flexible. This paper describes a PI-based embedding technology for integrating very thin silicon chips in between two spin-on PI layers, the ultra-thin chip package (UTCP). This paper discusses the different process steps in the UTCP production and also presents the interconnection test results realized with this technology.
Keywords :
assembling; elemental semiconductors; integrated circuit packaging; silicon; substrates; PI-based embedding technology; Si; UTCP; electronic assembly; flexible polyimide substrates; interconnection test; polyimide-based ultra-thin chip packaging technology; spin-on PI layers; thin silicon chips; Adhesives; Chip scale packaging; Laser ablation; Polyimides; Substrates; 3-D embedding; chip package; flexible; thin chip;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2010.2060198