DocumentCode :
1386403
Title :
Multiobjective Optimization of a Grooved Micro-Channel Heat Sink
Author :
Ansari, Danish ; Husain, Afzal ; Kim, Kwang-Yong
Author_Institution :
Dept. of Mech. Eng., Inha Univ., Incheon, South Korea
Volume :
33
Issue :
4
fYear :
2010
Firstpage :
767
Lastpage :
776
Abstract :
The shape optimization of a micro-channel heat sink with a grooved structure has been performed using a multiobjective evolutionary algorithm. The thermal-resistance and pumping-power characteristics of the micro-channel heat sink have been investigated numerically. For optimization, four design variables, i.e., the ratios of the groove depth to the micro-channel height, the groove pitch to the micro-channel height, the groove diameter to pitch, and the micro-channel width to height are selected. The thermal resistance and the pumping power are the objective functions. The Navier-Stokes and energy equations for laminar flow and conjugate heat transfer are solved using a finite-volume solver. In comparison with a smooth micro-channel, a decrease in the thermal resistance and an increase in the Nusselt number are obtained in a grooved micro-channel at the expense of pumping power. The thermal resistance in a grooved micro-channel is lower than that in a smooth micro-channel for a fixed pumping power. The ratio of the groove pitch to micro-channel height is found to be the most Pareto-sensitive (sensitive along the Pareto-optimal front), whereas the ratio of the micro-channel width to height is found to be the least Pareto-sensitive variable.
Keywords :
Navier-Stokes equations; heat sinks; laminar flow; microchannel flow; optimisation; thermal resistance; Navier-Stokes equation; Nusselt number; Pareto-optimal front; Pareto-sensitive variable; energy equation; finite-volume solver; grooved microchannel heat sink; grooved structure; laminar flow; multiobjective evolutionary algorithm; multiobjective optimization; pumping power; pumping-power characteristics; thermal resistance; Evolutionary computation; Heat sinks; Heat transfer; Microchannel; Optimization; Thermal resistance; Electronic cooling; groove; heat-transfer enhancement; micro-channel; optimization;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2010.2070874
Filename :
5643121
Link To Document :
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