Title :
Analysis of Current Distribution in Multi-Laminated HTS Tape Conductor for Double Pancake Coil of SMES
Author :
Hamajima, Takataro ; Atomura, Naoki ; Chiba, Yuta ; Yagai, Tsuyoshi ; Tsuda, Makoto ; Shikimachi, Koji ; Hirano, Naoki ; Nagaya, Shigeo
Author_Institution :
Grad. Sch., Electr. Commun. Eng. Dept., Tohoku Univ., Sendai, Japan
fDate :
6/1/2011 12:00:00 AM
Abstract :
A multi-laminated HTS tape conductor has been recently developed to fabricate large double pancake coils. If the HTS tapes are simply laminated to form the conductor, the current distribution in the laminated tape conductor of the coil is unbalanced because of different inductances of all tapes. It is very important to analyze current distributions in the multi-laminated tape conductor used for the double pancake coil for SMES. In this paper, we analyze the current distribution in the tape conductor by using electrical circuit model, and then discuss how to obtain the homogeneous current distribution. One way is to transpose the tape position at both ends of pancake coil so as to arrange the tapes symmetrically. However, this method is not perfectly geometrical symmetry for more than 3 laminated tapes in the conductor. We propose new method to obtain homogeneous current distribution by adjusting gaps between HTS tapes in the conductor. Finally we numerically demonstrate the homogeneous current distribution in the 4-laminated tapes with inserting additional thickness among tapes.
Keywords :
current distribution; high-temperature superconductors; inductance; laminations; superconducting magnet energy storage; superconducting magnets; SMES; current distribution; electrical circuit model; inductances; multi-laminated HTS tape conductor; pancake coils; Coils; Conductors; Current distribution; High temperature superconductors; Inductance; Integrated circuit modeling; Superconducting magnetic energy storage; Homogeneous current distribution; SMES; multi-laminated HTS tapes; pancake coil; transposition;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
DOI :
10.1109/TASC.2010.2086993