• DocumentCode
    1386917
  • Title

    Design and Manufacture of the Low-Resistance {\\rm Nb}_{3}{\\rm Sn} Joints for the CHMFL 40 T Hybrid Magnet

  • Author

    Tan, Yunfei ; Chen, Wenge ; Zhu, Jiawu ; Chen, Zhuomin ; Pan, Yinnian ; Wang, Futang ; Chen, Zhiyou ; He, Peng ; Ren, Yong ; Kuang, Guangli

  • Author_Institution
    High Magn. Field Lab., Chinese Acad. of Sci., Hefei, China
  • Volume
    21
  • Issue
    3
  • fYear
    2011
  • fDate
    6/1/2011 12:00:00 AM
  • Firstpage
    2020
  • Lastpage
    2023
  • Abstract
    Two kinds of Nb3Sn CICC joints have been designed for the superconducting coils of the 40 T hybrid magnet. The “terminal joint” is for the joints between the terminals of the superconducting coils. The “interlayer joint” is for the joints between the layers of the coils. Both the terminal joint and the interlayer joint are fabricated before heat treatment. The interlayer joint is not processed any more after heat treatment. The copper soles of the terminal joints are attached to each other with PbSn solder to join the superconducting coils to each other and to the current leads that connect to the power supply. Two full-size joints are being manufactured and will be tested in the High Magnetic Field Laboratory, Chinese Academy of Sciences (CHMFL). This paper will describe an overview of the joints´ design and fabrication, and the predicted joint resistances will be also presented.
  • Keywords
    heat treatment; superconducting cables; superconducting coils; superconducting magnets; Nb3Sn; cable-in-conduit conductor joint; copper sole; heat treatment; hybrid magnet; interlayer joint; joint resistance; superconducting coil; terminal joint; Cable shielding; Conductors; Copper; Heat treatment; Joints; Superconducting cables; Superconducting magnets; ${rm Nb}_{3}{rm Sn}$ CICC; Hybrid magnet; low-resistance ${rm Nb}_{3}{rm Sn}$ joint;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/TASC.2010.2087306
  • Filename
    5643195