DocumentCode
1387371
Title
Molding challenges of LOC packages with large devices
Author
Paquet, Marie-Claude
Author_Institution
IBM Canada, Bromont, Canada
Volume
21
Issue
2
fYear
1998
fDate
4/1/1998 12:00:00 AM
Firstpage
142
Lastpage
147
Abstract
This paper presents the manufacturing challenges that were met for plastic encapsulation of lead on chip (LOG) products with large device-to-package area ratios. A new methodology for optimizing product and process performance has been used to eliminate the injection problems which were encountered with these packages. The influence of pellet preheat time and clamping force on the voids and on the knit-lines has been clearly demonstrated in a screening study. The injection speeds have been optimized to completely eliminate the emergence of the defects in a subsequent focusing study
Keywords
encapsulation; integrated circuit packaging; plastic packaging; voids (solid); LOC package; clamping force; defects; focusing; injection; knit-lines; manufacturing; pellet preheating; plastic encapsulation; process optimization; screening; transfer molding; voids; Assembly; Bonding; Encapsulation; Lab-on-a-chip; Optimization methods; Plastic packaging; Qualifications; Robustness; Testing; Transfer molding;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part C, IEEE Transactions on
Publisher
ieee
ISSN
1083-4400
Type
jour
DOI
10.1109/3476.681392
Filename
681392
Link To Document