Title :
Investigation and Optimization of LEKID Coupling Structures and Multi-Pixel Arrays at 4.2 K
Author :
Wuensch, S. ; Hammer, G. ; Kappler, T. ; Geuppert, F. ; Siegel, M.
Author_Institution :
Inst. fur Mikro- und Nanoelektronische Syst., Karlsruhe Inst. of Technol., Karlsruhe, Germany
fDate :
6/1/2011 12:00:00 AM
Abstract :
The development of large multi-pixel detector applications with lumped element kinetic inductance detectors (LEKID) requires a detailed knowledge about the mode of operation in respect of the microwave regime. In this paper the basic properties of LEKID structures for applications at liquid helium temperatures were investigated. In consideration of the operation temperature, the different microwave behavior of LEKID structures coupled to microstrip and coplanar strip readout transmission lines, e.g. loaded and unloaded quality factors, have been examined. For this purpose several test structures, which are suitable for large arrays, in multi-pixel applications, were designed and characterized with frequency around 6 GHz. Loaded quality factors QL up to 10,000 at 4.2 K were achieved. The devices were fabricated in niobium thin film technology on silicon substrates. LEKID arrays with 3 resonators were designed, fabricated and measured with our self-developed FDM readout system. The results of the measurements will be presented and discussed.
Keywords :
coplanar waveguides; microstrip lines; superconducting microwave devices; FDM readout system; LEKID coupling structures; LEKID structures; coplanar strip readout transmission lines; liquid helium temperatures; lumped element kinetic inductance detectors; microstrip readout transmission lines; microwave regime; multipixel arrays; multipixel detector application; niobium thin film technology; quality factors; silicon substrates; Couplings; Detectors; Microwave measurements; Microwave theory and techniques; Pixel; Q factor; Resonant frequency; Kinetic inductance detector; microwave; resonator; superconducting; transmission lines;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
DOI :
10.1109/TASC.2010.2090445