• DocumentCode
    1389763
  • Title

    A vertical high voltage termination structure for high-resistivity silicon detectors

  • Author

    Segal, J.D. ; Kenney, C.J. ; Aw, C.H. ; Parker, S.I. ; Vilkelis, G. ; Iwanczyk, J.S. ; Patt, B.E. ; Plummer, J.

  • Author_Institution
    HPL Inc., Milpitas, CA, USA
  • Volume
    45
  • Issue
    3
  • fYear
    1998
  • fDate
    6/1/1998 12:00:00 AM
  • Firstpage
    364
  • Lastpage
    369
  • Abstract
    A new high voltage diode termination structure has been developed for the backside junction of silicon detectors which require double-sided processing. The new structure consists of a deep vertical etch through the diode at the edge of the detector. It requires only one mask, and is extremely robust to scratches or other mechanical damage. The vertical termination has been successfully applied to an integrated pixel detector, where it increased yield. It has also been applied to an 8mm diameter cylindrical drift detector
  • Keywords
    silicon radiation detectors; Si; Si detectors; backside junction; cylindrical drift detector; double-sided processing; high voltage termination structure; high-resistivity Si; high-resistivity Si detectors; integrated pixel detector; Detectors; Etching; Face detection; Integrated circuit technology; Medical simulation; Robustness; Semiconductor diodes; Semiconductor materials; Silicon; Voltage;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/23.682409
  • Filename
    682409