Title :
A novel stimulation for multi-class SSVEP-based brain-computer interface using patterns of time-varying frequencies
Author :
Dehzangi, Omid ; Nathan, Viswam ; Chengzhi Zong ; Chang Lee ; Insoo Kim ; Jafari, Roozbeh
Author_Institution :
Univ. of Texas at Dallas, Richardson, TX, USA
Abstract :
Steady-state visual evoked potential (SSVEP) has become one of the most widely employed modalities in online brain computer interface (BCI) because of its high signal-to-noise ratio. However, due to the limitations of brain physiology and the refresh rate of the display devices, the available stimulation frequencies that evoke strong SSVEPs are generally limited for practical applications. In this paper, we introduce a novel stimulation method using patterns of time-varying frequencies that can increase the number of visual stimuli with a fixed number of stimulation frequencies for use in multi-class SSVEP-based BCI systems. We then propose a probabilistic framework and investigate three approaches to detect different patterns of time-varying frequencies. The results confirmed that our proposed stimulation is a promising method for multi-class SSVEP-based BCI tasks. Our pattern detection approaches improved the detection performance significantly by extracting higher quality discriminative information from the input signal.
Keywords :
brain; brain-computer interfaces; electroencephalography; medical signal detection; medical signal processing; probability; visual evoked potentials; brain physiology; display devices; high signal-to-noise ratio; multiclass SSVEP-based BCI systems; multiclass SSVEP-based brain-computer interface; online brain computer interface; pattern detection approaches; probabilistic framework; steady-state visual evoked potential; time-varying frequencies; visual stimuli; Brain-computer interfaces; Correlation; Electroencephalography; Electronic mail; Time-frequency analysis; Visualization;
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2014 36th Annual International Conference of the IEEE
Conference_Location :
Chicago, IL
DOI :
10.1109/EMBC.2014.6943543