Title :
Electronic packaging in the 1990s-a perspective from Asia
Author_Institution :
NTT Appl. Electron. Lab., Tokyo, Japan
fDate :
6/1/1991 12:00:00 AM
Abstract :
The present status and future trends in electronic packaging technologies are reviewed. Advanced modules packaged with these technologies are shown in three major applications: switching systems, transmission systems, and computer systems. Outlined are VLSI chip interconnection by the tape automated bonding (TAB) method; bump bonding; fine-pitch ceramic flat package suitable for single-chip packaging; multichip packaging using a copper-polyimide substrate for high-speed signal transmission; high-density multilayer printed circuit boards and glass ceramic boards for second-level packaging; and advanced cooling systems
Keywords :
VLSI; cooling; modules; packaging; printed circuits; tape automated bonding; VLSI chip interconnection; bump bonding; computer systems; cooling; electronic packaging technologies; fine-pitch ceramic flat package; modules; multichip packaging; multilayer printed circuit boards; second-level packaging; signal transmission; switching systems; tape automated bonding; transmission systems; Application software; Asia; Bonding; Ceramics; Electronics packaging; Integrated circuit interconnections; Nonhomogeneous media; Printed circuits; Switching systems; Very large scale integration;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
