Title :
Electronic packaging in the 1990s-a perspective from America
Author_Institution :
IBM Corp., Hopewell Junction, NY, USA
fDate :
6/1/1991 12:00:00 AM
Abstract :
The author reviews current packaging technologies. He starts with the packaging environment in the US, then projects the system requirements into the year 2000 and reviews the base packaging technologies currently in use from consumer electronics to mainframe computers. He ends with projected advanced packaging in all the key technologies: chip-level connections, power distribution, and heat removal from the chip, first-level single-chip and multichip packages, package-to-board interconnections, and second-level packages
Keywords :
cooling; packaging; chip-level connections; consumer electronics; heat removal; mainframe computers; multichip packages; package-to-board interconnections; packaging environment; packaging technologies; power distribution; second-level packages; system requirements; Acceleration; Containers; Costs; Electronics packaging; Laboratories; Material storage; Packaging machines; Power engineering and energy; Power engineering computing; Semiconductor device packaging;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
