DocumentCode :
1391017
Title :
Abstracts of forthcoming manuscripts
Volume :
23
Issue :
3
fYear :
2000
fDate :
7/1/2000 12:00:00 AM
Firstpage :
154
Lastpage :
156
Abstract :
Provides an abstract of articles to be presented in a forthcoming issue.
fLanguage :
English
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-334X
Type :
jour
DOI :
10.1109/TEPM.2000.873241
Filename :
873241
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1391017
