A comparison of PWB warpage due to simulated infrared and wave soldering processes

Author

Polsky, Yarom ; Sutherlin, Walter ; Ume, I. Charles

Author_Institution

MDI Inc., Sugar Land, TX, USA

Volume

23

Issue

3

fYear

2000

fDate

7/1/2000 12:00:00 AM

Firstpage

191

Lastpage

199

Abstract

Two types of bare, four layer printed wiring board (PWB) test vehicles were designed and fabricated to replicate simplified versions of typical boards produced by PWB manufacturers. The boards were subjected to simulated infrared and wave soldering reflow processes in a small lab-scale oven integrated with a shadow Moire out-of-plane displacement measurement system. The measured warpages were qualitatively and quantitatively analyzed at selected temperatures during the reflow profiles. The results presented compare and contrast the effects that simulated wave and infrared reflow soldering processes have on the warpage of two different PWB designs

Keywords

displacement measurement; moire fringes; printed circuit manufacture; printed circuit testing; production testing; reflow soldering; wave soldering; PWB warpage; four layer printed wiring board; infrared soldering; reflow processes; shadow Moire out-of-plane displacement measurement; test vehicles; wave soldering processes; Assembly; Electronics packaging; Manufacturing processes; Mechanical engineering; Soldering; Temperature; Testing; Thermal expansion; Vehicles; Wiring;

fLanguage

English

Journal_Title

Electronics Packaging Manufacturing, IEEE Transactions on

Publisher

ieee

ISSN

1521-334X

Type

jour

DOI

10.1109/6104.873247

Filename

873247