Experimental techniques for electrical testing of microelectronics coatings

Triple-track and interdigitated comb patterns used in testing of encapsulated microelectronic circuits are considered. The tests involved high-resistance DC measurements; e.g. applying 10-200-V DC and measuring currents in the 0.1-10-pA range. At these resistance levels, shunt impedances, arising from a variety of sources, have an impact on results. Without careful experimental design, one encounters artifacts that have nothing to do with the circuit/specimen under test. The authors detail proper experimental design, together with practical tests for artifacts. Both bulk- and interphase-resistance measurements are discussed