Experimental techniques for electrical testing of microelectronics coatings

Author

Troyk, Philip R. ; Francovik, R. ; Anderson, James E.

Author_Institution

Pritzker Inst. of Med. Eng., Illinois Inst. of Technol., Chicago, IL, USA

Volume

14

Issue

2

fYear

1991

fDate

6/1/1991 12:00:00 AM

Firstpage

428

Lastpage

435

Abstract

Triple-track and interdigitated comb patterns used in testing of encapsulated microelectronic circuits are considered. The tests involved high-resistance DC measurements; e.g. applying 10-200-V DC and measuring currents in the 0.1-10-pA range. At these resistance levels, shunt impedances, arising from a variety of sources, have an impact on results. Without careful experimental design, one encounters artifacts that have nothing to do with the circuit/specimen under test. The authors detail proper experimental design, together with practical tests for artifacts. Both bulk- and interphase-resistance measurements are discussed

Keywords

electric resistance measurement; encapsulation; integrated circuit testing; 0.1 to 10 pA; 10 to 200 V; artifacts; electrical testing; encapsulated microelectronic circuits; high-resistance DC measurements; interdigitated comb patterns; interphase-resistance measurements; microelectronics coatings; shunt impedances; triple-track patterns; Circuit testing; Coatings; Conductivity; Current measurement; Electric resistance; Electrical resistance measurement; Leakage current; Metallization; Microelectronics; Polymer films;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.87325

Filename

87325