DocumentCode :
1391084
Title :
Research concerning the separation and recovery of used printed wiring board solder
Author :
Yamagiwa, Yasuyuki ; Soyama, Shinichi ; Iwata, Shuichi
Author_Institution :
Sony Corp., Tokyo, Japan
Volume :
23
Issue :
3
fYear :
2000
fDate :
7/1/2000 12:00:00 AM
Firstpage :
214
Lastpage :
218
Abstract :
In recent years, with industries becoming more concerned about environmental problems, there has been a noticeable move toward regulating the use of lead in Europe and other regions. In line with this, there has been an increase in research concerning lead-free solder and its use as a substitute for regular solder. However, even if lead-free solder is used in newly developed products, products already on the market will still incorporate regular solder. This paper reports the results of tests using experimental equipment to verify a method of separating and recovering solder from the printed wiring boards (PWBs) of products to be scrapped
Keywords :
lead alloys; printed circuits; recycling; soldering; Pb-based solders; printed wiring board solder; recycling; scrapped products; solder recovery; solder separation; used PWB solder; Consumer electronics; Environmental factors; Environmentally friendly manufacturing techniques; Europe; Home appliances; Joining processes; Lead; Refrigerators; Testing; Wiring;
fLanguage :
English
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-334X
Type :
jour
DOI :
10.1109/6104.873250
Filename :
873250
Link To Document :
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