• DocumentCode
    139115
  • Title

    Morphological and electrochemical properties of an explanted PtIr electrode array after 15 months in vivo

  • Author

    Kohler, Fabian ; Stieglitz, T. ; Schuettler, Martin

  • Author_Institution
    Dept. of Microsyst. Eng., Univ. of Freiburg, Freiburg, Germany
  • fYear
    2014
  • fDate
    26-30 Aug. 2014
  • Firstpage
    418
  • Lastpage
    421
  • Abstract
    We investigated the morphological and electrochemical properties of an explanted laser-machined 32 channel electrocorticogram (ECoG) electrode array made of platinum-iridium and silicone rubber. It was connected to a wireless brain-computer interface (BCI) and implanted in a sheep for more than 15 months. Recordings and stimulations of cortical activity were conducted over the whole period on a regularly basis. Currently, this is the longest in vivo study for this type of ECoG electrode array. Results were compared with an unused electrode array of same dimensions, material and production method. Visual inspections revealed no significant material alterations, despite organic residuals which could be easily removed though. Electrochemical impedance measurements also attested proper long-term stability of magnitude and phase, the difference between explanted electrode contacts and those of the unused array were found negligible.
  • Keywords
    bioelectric phenomena; biomedical electrodes; brain; brain-computer interfaces; electrochemistry; handicapped aids; iridium alloys; platinum alloys; silicone rubber; BCI; ECoG electrode array; cortical activity; electrochemical impedance measurements; electrochemical properties; explanted laser-machined 32 channel electrocorticogram electrode array; long-term stability; morphological properties; silicone rubber; wireless brain-computer interface; Arrays; Contacts; Electrodes; Impedance; In vivo; Materials; Scanning electron microscopy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society (EMBC), 2014 36th Annual International Conference of the IEEE
  • Conference_Location
    Chicago, IL
  • ISSN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/EMBC.2014.6943617
  • Filename
    6943617