DocumentCode
139127
Title
The effect of site placement within silicon microelectrodes on the long-term electrophysiological recordings
Author
Heui Chang Lee ; Gaire, Janak ; McDowell, Sean P. ; Otto, Kevin J.
Author_Institution
Weldon Sch. of Biomed. Eng., Purdue Univ., West Lafayette, IN, USA
fYear
2014
fDate
26-30 Aug. 2014
Firstpage
465
Lastpage
468
Abstract
Intracortical microelectrodes can be used to treat various neurological disorders given their capabilities to interface with single or multiple populations of neurons. However, most of these penetrating devices have been reported to fail over time, within weeks to months, putatively due to the foreign body response (FBR) which persistently aggravates the surrounding brain tissues. A number of studies have confirmed that various electrode properties, such as size, shape, and surface area, may play a role in the biological responses to the microelectrode. Further experimental data is needed to determine the effect of these properties on the FBR and the recording performance. In this paper, we evaluate the effect of site placement using Michigan arrays with sites on the center, edge, and tip of the shank. The results show that there is significant performance variance between the center, edge, and tip sites.
Keywords
bioelectric potentials; biological tissues; biomedical electrodes; brain; medical disorders; microelectrodes; neurophysiology; silicon; surgery; Michigan arrays; Si; biological responses; brain tissues; electrode properties; electrode shape; electrode size; foreign body response; intracortical microelectrodes; long-term electrophysiological recordings; multiple neuron populations; neurological disorders; penetrating devices; recording performance; silicon microelectrodes; single neuron population; site placement effect; surface area; Image edge detection; Impedance; Implants; Microelectrodes; Neurons; Performance evaluation;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society (EMBC), 2014 36th Annual International Conference of the IEEE
Conference_Location
Chicago, IL
ISSN
1557-170X
Type
conf
DOI
10.1109/EMBC.2014.6943629
Filename
6943629
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