DocumentCode :
1391484
Title :
Global EMC and SI University in Pittsburgh at EMC 2012
Author :
Bunting, C.
Author_Institution :
Oklahoma State University
Volume :
1
Issue :
4
fYear :
2012
Firstpage :
73
Lastpage :
74
Abstract :
Electronic products today, in all applications, are still driven by the five important forces of faster, denser, cheaper, lower power, NOW! New design principles and technology options continually evolve to fuel these advances. Engineers at all levels, from beginner to expert, must constantly learn new solutions to keep up with new problems. The Global University Program was established to help engineers get a jump-start in advancing to their next level of understanding so they can apply solid engineering principles to practical design solutions.
fLanguage :
English
Journal_Title :
Electromagnetic Compatibility Magazine, IEEE
Publisher :
ieee
ISSN :
2162-2264
Type :
jour
DOI :
10.1109/MEMC.2012.6397062
Filename :
6397062
Link To Document :
بازگشت