DocumentCode
1391650
Title
Heat transport from a chip
Author
Lang, Walter
Author_Institution
Fraunhofer Inst. fuer Festkoerpertechnol., Munich, West Germany
Volume
37
Issue
4
fYear
1990
fDate
4/1/1990 12:00:00 AM
Firstpage
958
Lastpage
963
Abstract
The heat transport from a chip due to conduction and interphase heat transfer from the chip to the surrounding air are investigated. Experiments with thin diaphragms of silicon nitride, which can be heated by a thin-film resistor, were performed. The heat losses of the devices were measured in vacuum and in air. The influence of temperature, geometry, and heat sinks was investigated. Heat transfer is described by the transfer coefficient, which is a function of the temperature and the size of the chip. The calculated heat losses are in good agreement with the experimental values
Keywords
heat conduction; heat losses; heat sinks; heat transfer; monolithic integrated circuits; packaging; temperature distribution; Si3N4 thin diaphragms; chip; conduction; heat losses; heat sinks; heat transport; interphase heat transfer; thin-film resistor; transfer coefficient; Acceleration; Equations; Heat sinks; Heat transfer; Resistors; Semiconductor device measurement; Thermal conductivity; Thermal management; Thermal management of electronics; Thermal sensors;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.52430
Filename
52430
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