Title :
Heat transport from a chip
Author_Institution :
Fraunhofer Inst. fuer Festkoerpertechnol., Munich, West Germany
fDate :
4/1/1990 12:00:00 AM
Abstract :
The heat transport from a chip due to conduction and interphase heat transfer from the chip to the surrounding air are investigated. Experiments with thin diaphragms of silicon nitride, which can be heated by a thin-film resistor, were performed. The heat losses of the devices were measured in vacuum and in air. The influence of temperature, geometry, and heat sinks was investigated. Heat transfer is described by the transfer coefficient, which is a function of the temperature and the size of the chip. The calculated heat losses are in good agreement with the experimental values
Keywords :
heat conduction; heat losses; heat sinks; heat transfer; monolithic integrated circuits; packaging; temperature distribution; Si3N4 thin diaphragms; chip; conduction; heat losses; heat sinks; heat transport; interphase heat transfer; thin-film resistor; transfer coefficient; Acceleration; Equations; Heat sinks; Heat transfer; Resistors; Semiconductor device measurement; Thermal conductivity; Thermal management; Thermal management of electronics; Thermal sensors;
Journal_Title :
Electron Devices, IEEE Transactions on
