Title :
Three-dimensional high-frequency distribution networks. II. Packaging and integration
Author :
Henderson, Rashaunda M. ; Herrick, Katherine J. ; Weller, Thomas M. ; Robertson, S.V. ; Kihm, R.T. ; Katehi, Linda P B
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
fDate :
10/1/2000 12:00:00 AM
Abstract :
This paper describes the implementation and packaging of the components, described in Part I of this paper, to realize a three-dimensional W-band distribution network
Keywords :
coplanar waveguides; interconnections; micromachining; millimetre wave circuits; packaging; power combiners; 3D MM-wave distribution networks; CPW; EHF; W-band; packaging; three-dimensional distribution network; Distributed parameter circuits; Frequency; Laboratories; Micromachining; Microwave circuits; Microwave devices; Packaging; Performance loss; Power generation; Power transmission lines;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
