DocumentCode
1391956
Title
Mechanism analysis of ultrasonic treatment on SU-8 swelling in UV-LIGA technology
Author
Liqun Du ; Yaping Liu ; Chengbin Li
Author_Institution
Key Lab. for Micro/Nano Technol. & Syst. of Liaoning Province, Dalian Univ. of Technol., Dalian, China
Volume
6
Issue
11
fYear
2011
Firstpage
900
Lastpage
903
Abstract
In SU-8 UV-LIGA technology, the precision and controllability of electroformed metal structure are not satisfied because of SU-8 photoresist swelling during electroforming process. To reduce SU-8 swelling and further improve the dimensional precision of electroformed microstructure, the authors originally introduce ultrasonic treatment in the fabrication process of SU-8 mould. The experimental results indicate that the swelling property of cross-linked cured SU-8 varies with ultrasonic time. SU-8 swelling is diminished when it is treated less than 15 min by ultrasonic, but the swelling is increased if the ultrasonic time is extended to 20 min. To explore ultrasonic treatment mechanism of SU-8 swelling, the contact angle between SU-8 and electroforming solutions in different ultrasonic time was measured, and the result presents that SU-8 surface hydrophilicity is affected by ultrasonic treatment. Besides, the contact angle trend is consistent with the curve of SU-8 swelling removal ratio in different ultrasonic time. Subsequently, ultrasonic treatment mechanism of SU-8 swelling is proposed based on ultrasonic mechanical scission of polymer chain and moisture diffusion mechanism.
Keywords
LIGA; contact angle; diffusion; electroforming; hydrophilicity; photoresists; polymer structure; resins; swelling; ultrasonic materials testing; SU-8 UV-LIGA technology; SU-8 moulding; SU-8 photoresist swelling; SU-8 surface hydrophilicity; SU-8 swelling curve; contact angle; cross-linked cured SU-8; electroformed metal structure; electroformed microstructure; electroforming processing; electroforming solutions; fabrication processing; moisture diffusion mechanism; polymer chain; swelling property; ultrasonic mechanical scission; ultrasonic treatment mechanism;
fLanguage
English
Journal_Title
Micro & Nano Letters, IET
Publisher
iet
ISSN
1750-0443
Type
jour
DOI
10.1049/mnl.2011.0515
Filename
6096499
Link To Document