• DocumentCode
    1391995
  • Title

    Electron trapping in Si implanted SIMOX

  • Author

    Bhar, T.N. ; Lambert, R.J. ; Hughes, H.L.

  • Author_Institution
    Univ. of the District of Columbia, Washington, DC, USA
  • Volume
    34
  • Issue
    10
  • fYear
    1998
  • fDate
    5/14/1998 12:00:00 AM
  • Firstpage
    1026
  • Lastpage
    1027
  • Abstract
    The implantation and annealing processes of SIMOX fabrication may result in excess silicon atoms located in the buried oxide. These excess silicon atoms have been postulated by various researchers to be responsible for the formation of silicon clusters and associated defects in SIMOX. This work was performed to test this postulate. These defects result in a higher refractive index, an increase in the number of electron traps, and the production of traps with very large capture cross-sections. It is also known that excess silicon introduced by ion implantation creates electron traps in thermal oxides. This work supports the above postulate by implanting a large range of silicon concentrations into low defect multiple implant SIMOX and measuring the resulting electron traps by the avalanche injection technique
  • Keywords
    SIMOX; annealing; buried layers; crystal defects; electron traps; elemental semiconductors; ion implantation; segregation; silicon; SIMOX fabrication; SOI technology; Si clusters; Si implanted SIMOX; SiO2:Si; annealing processes; avalanche injection technique; buried oxide; capture cross-section; defects; electron traps; ion implantation; refractive index; thermal oxides;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el:19980626
  • Filename
    682997