DocumentCode
1391995
Title
Electron trapping in Si implanted SIMOX
Author
Bhar, T.N. ; Lambert, R.J. ; Hughes, H.L.
Author_Institution
Univ. of the District of Columbia, Washington, DC, USA
Volume
34
Issue
10
fYear
1998
fDate
5/14/1998 12:00:00 AM
Firstpage
1026
Lastpage
1027
Abstract
The implantation and annealing processes of SIMOX fabrication may result in excess silicon atoms located in the buried oxide. These excess silicon atoms have been postulated by various researchers to be responsible for the formation of silicon clusters and associated defects in SIMOX. This work was performed to test this postulate. These defects result in a higher refractive index, an increase in the number of electron traps, and the production of traps with very large capture cross-sections. It is also known that excess silicon introduced by ion implantation creates electron traps in thermal oxides. This work supports the above postulate by implanting a large range of silicon concentrations into low defect multiple implant SIMOX and measuring the resulting electron traps by the avalanche injection technique
Keywords
SIMOX; annealing; buried layers; crystal defects; electron traps; elemental semiconductors; ion implantation; segregation; silicon; SIMOX fabrication; SOI technology; Si clusters; Si implanted SIMOX; SiO2:Si; annealing processes; avalanche injection technique; buried oxide; capture cross-section; defects; electron traps; ion implantation; refractive index; thermal oxides;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:19980626
Filename
682997
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