Title :
Packaged photonic probes for an on-wafer broad-band millimeter-wave network analyzer
Author :
Sahri, Nabil ; Nagatsuma, Tadao
Author_Institution :
Alcatel OPTO+/Corp. Res. Center, Marcoussis, France
Abstract :
We report the fabrication of integrated and packaged active photonic probes that enable on-wafer measurements of electrical scattering parameters with a bandwidth exceeding 300 GHz. The probes use a high-speed uni-traveling-carrier photodiode (UTC-PD) to optically generate the electrical stimulus and the electro-optic sampling (EOS) technique to measure the electrical signals. The modules are packaged using micro-optic technology and exhibit excellent optical characteristics. They are easy to use, enable reliable and reproducible measurements, and should help to overcome the bandwidth-limitation of present all-electronic similar systems.
Keywords :
electro-optical effects; integrated circuit testing; microwave photonics; network analysers; packaging; photodiodes; 300 GHz; all-electronic systems; bandwidth-limitation; electrical scattering parameters; electrical signals; electrical stimulus; electro-optic sampling; high-speed uni-traveling-carrier photodiode; micro-optic technology; on-wafer broad-band millimeter-wave network analyzer; optical characteristics; packaged active photonic probes; packaged photonic probes; Bandwidth; Electric variables measurement; High speed optical techniques; Millimeter wave measurements; Millimeter wave technology; Optical device fabrication; Optical scattering; Packaging; Probes; Scattering parameters;
Journal_Title :
Photonics Technology Letters, IEEE
