DocumentCode
1392562
Title
A New Power-Ground Plane Modeling Method With Rectangle and Triangle Segmentation
Author
Liu, Chuntian ; Mao, Junfa ; Tang, Min
Author_Institution
Dept. of Electron. Eng., Shanghai Jiao Tong Univ., Shanghai, China
Volume
33
Issue
3
fYear
2010
Firstpage
639
Lastpage
646
Abstract
A new power-ground modeling method combining rectangles and triangles partition is proposed for the analysis of the ground bounce noise in high-speed digital systems. In this method, the cavity model is used to analyze rectangular segments and the lumped model is used to analyze triangle meshes. The resultant inner virtual ports and simulation time can be reduced significantly. In addition, multilayered planes with apertures can be dealt with using the impedance matrix model. The results of this method are demonstrated to be accurate over a wide range of frequencies.
Keywords
circuit noise; digital circuits; impedance matrix; mesh generation; network analysis; ground bounce noise analysis; high-speed digital systems; impedance matrix model; lumped model; multilayered planes; power-ground plane modeling method; rectangle segmentation; triangle mesh analysis; triangle segmentation; Cavity model; Delaunay triangular mesh; power-ground modeling; rectangle and triangle partition;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/TADVP.2009.2037603
Filename
5395611
Link To Document