Title :
Study of Carrier Mobility of Low-Energy High-Dose Ion Implantations
Author :
Qin, Shu ; Prussin, Simon A. ; Reyes, Jason ; Hu, Yongjun Jeff ; McTeer, Allen
Author_Institution :
Process R/D Dept., Micron Technol., Inc., Boise, ID, USA
Abstract :
New carrier drift mobility data for boron-, phosphorus-, and arsenic-doped Si in a low-energy high-dose implant regime are measured and studied using a continuous anodic oxidation technique/differential Hall effect technique. The data show that, when the doping concentration is >; 1020/cm3, both the hole and electron mobility values are lower than the conventional model predictions, and the electron mobility of the As-doped Si is lower than that of the P-doped ones. The data also show that, when the doping concentration is >; 1021/cm3 the hole mobility in the B-doped Si and the electron mobility in the P-doped Si are almost equal and reach as low as ~40 cm2/V · s, and the electron mobility of the As-doped Si is the lowest and reaches ~30 cm2/V · s. These mobility data are much lower than the conventional model predictions and are also lower than the previously published data. For the ULSI device and circuit analyses, simulations, and designs, these new mobility data need to be taken into consideration.
Keywords :
Hall effect; anodisation; arsenic; boron; doping profiles; electron mobility; elemental semiconductors; hole mobility; phosphorus; plasma immersion ion implantation; semiconductor doping; silicon; Si:As; Si:B; Si:P; ULSI device; carrier drift mobility; circuit analysis; continuous anodic oxidation; differential Hall effect; doping concentration; electron mobility; hole mobility; low-energy high-dose ion implantations; Annealing; Doping; Electron mobility; Implants; Impurities; Semiconductor device measurement; Silicon; Carrier and mobility profiles; continuous anodic oxidation technique/differential Hall effect (CAOT/DHE) method; low-energy high-dose implants; plasma doping (PLAD); spreading resistance profiling (SRP) method;
Journal_Title :
Plasma Science, IEEE Transactions on
DOI :
10.1109/TPS.2010.2089702