Multipath delay measurements and modeling for interfloor wireless communications

This paper presents a comprehensive three-dimensional (3-D) ray-tracing model for interfloor wireless communication systems, and measurements of power delay profiles in a typical two-floor environment. The model takes into account all possible reflections/transmissions between/through walls, floors and ceilings including possible scattering from nearby buildings, as well as diffractions from corners and edges of building structures, and also subsequent reflections/transmissions from such diffracted signals. Propagation paths involving successive diffractions at the edges of window frames at different floors of the building and their subsequent reflections/transmissions from such diffracted signals are also included. The model is based on a uniform theory of diffraction (UTD) formulation, multiple image and 3-D ray launching concepts to include all the major propagation paths. Comparisons between results from theoretical models and measurements have shown good agreement for power delay profiles, root-mean-square (rms) delay spreads and signal path loss