Title : 
Electron-Related Phenomena at the 
  
  Interface
 
        
            Author : 
Rao, Rosario ; Lorenzi, Paolo ; Ghidini, Gabriella ; Palma, Fabrizio ; Irrera, Fernanda
         
        
            Author_Institution : 
Dipt. di Ing. Elettron., Univ. degli studi di Roma La Sapienza, Rome, Italy
         
        
        
        
        
            fDate : 
3/1/2010 12:00:00 AM
         
        
        
        
            Abstract : 
The goal of this work is to study the transient electrical features of metal/high-k interface in MOS stacks. To this aim, electrons are injected from the gate of TaN/Al2O3/SiO2/p-Si capacitors in pulsed regime. The displacement current flowing during the pulse front is detected, and the capacitance is extracted. As a result, for the first time, a flat-band instability related to electron trapping in states near the metal/high-k interface is measured on a millisecond timescale. A picture of the time evolution of the charge density inside the oxide bulk is drawn, with the aid of a finite-element simulator. Reliability of the metal/high-k interface is also investigated by performing stress experiments in pulsed conditions. It is shown that after a certain number of pulses, the creation of new traps at the top interface of the MOS stack becomes relevant.
         
        
            Keywords : 
MOS capacitors; aluminium compounds; capacitance; electron traps; elemental semiconductors; finite element analysis; high-k dielectric thin films; silicon; silicon compounds; tantalum compounds; MOS stack; TaN-Al2O3-SiO2-Si; charge density; displacement current; electron trapping; finite-element simulator; flat-band instability; interface degradation; metal-high k interface; millisecond timescale; pulsed C-V technique; Aluminum oxide; Capacitance; Dielectric devices; Dielectric substrates; Electron traps; MOS capacitors; Nonvolatile memory; Senior members; Thermal resistance; Time measurement; Electron trapping; interface degradation; metal/high- $k$ interface; pulsed $C$–$V$ technique;
         
        
        
            Journal_Title : 
Electron Devices, IEEE Transactions on
         
        
        
        
        
            DOI : 
10.1109/TED.2009.2039100