DocumentCode
139362
Title
Simulation study for a new magnetic induction tomography coil system with weakly perturbing in conducting background
Author
Ziyi Zhang ; Peiguo Liu ; Dongming Zhou ; Liang Zhang ; Hengdong Lei
Author_Institution
Coll. of Sci., Nat. Univ. of Defense Technol., Changsha, China
fYear
2014
fDate
26-30 Aug. 2014
Firstpage
1127
Lastpage
1130
Abstract
Biomedical magnetic induction tomography (MIT) aims to reconstruct the passive electrical properties within biological tissues, especially the electrical conductivity. A weak perturbation inside a conducting object is put in the improved MIT coil system which uses the two-arm Archimedean spiral coil as the excitation coil and the circular coil as the receiver coil. The forward problem for this model is calculated by three-dimension electromagnetic simulation experiments. Under the different simulation conditions, the phase shift of voltage induced in the receiver coil is compared with that for the common model using the circular coil as the excitation and receiver coil. The results show that the sensitivity to the improved model is much higher than that to the common model except for the case that the perturbation appears in y-axis, which effectively confirms the previous conclusions and indicates that the improved coil system has the potential advantage for MIT image reconstruction.
Keywords
biological tissues; biomedical imaging; electromagnetic induction; image reconstruction; tomography; 3D electromagnetic simulation experiment; biological tissues; biomedical magnetic induction tomography; circular coil; conducting background; electrical conductivity; excitation coil; magnetic induction tomography coil system; passive electrical property; receiver coil; two-arm Archimedean spiral coil; weak perturbation; Abstracts; Augmented reality; Cameras; Computer vision; Geometry; Google; Mobile communication;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society (EMBC), 2014 36th Annual International Conference of the IEEE
Conference_Location
Chicago, IL
ISSN
1557-170X
Type
conf
DOI
10.1109/EMBC.2014.6943793
Filename
6943793
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