INSPAD: a system for automatic bond pad inspection

Author

Ahmed, Mansoor ; Cole, Charles E. ; Jain, Ramesh C. ; Rao, A. Ravishankar

Author_Institution

Artificial Intelligence Lab., Michigan Univ., Ann Arbor, MI, USA

Volume

3

Issue

3

fYear

1990

fDate

8/1/1990 12:00:00 AM

Firstpage

145

Lastpage

147

Abstract

A method of detecting probe mark defects in semiconductor bond pads is presented that uses digitized images of color Polaroid photographs from an optical microscope. INSPAD inspects the bond pads in a magnified IC circuit image taken after the electrical testing stage. These are: probe marks must not extend beyond pad boundaries such that they damage glassivation; scratches on the bond pads must not exceed 50% of the bond pad width; and the probe marks must not exceed 25% of the bond pad area. Three types of commonly used bond pad geometries have been addressed. Morphological filtering is performed on the bond pad, to isolate and identify the major probe mark regions. Inspection of each pad takes approximately 2 to 3 s on an Apollo DN-4000 workstation which makes it suitable for real-time applications

Keywords

automatic test equipment; inspection; integrated circuit manufacture; Apollo DN-4000 workstation; INSPAD; automatic bond pad inspection; automatic optical inspection; bond pad geometries; detecting probe mark defects; digitized images of color Polaroid photographs; magnified IC circuit image; morphological filtering; optical microscope; probe marks; real-time applications; semiconductor bond pads; Automatic optical inspection; Bonding; Circuit testing; Filtering; Geometry; Integrated circuit testing; Optical filters; Optical microscopy; Probes; Workstations;

fLanguage

English

Journal_Title

Semiconductor Manufacturing, IEEE Transactions on

Publisher

ieee

ISSN

0894-6507

Type

jour

DOI

10.1109/66.56571

Filename

56571