Title :
Alpha-Particle Emission Energy Spectra From Materials Used for Solder Bumps
Author :
Gordon, Michael S. ; Rodbell, Kenneth P. ; Heidel, David F. ; Murray, Conal E. ; Tang, Henry H K ; Dwyer-McNally, Brendan ; Warburton, William K.
Author_Institution :
IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
Abstract :
The emitted alpha particle energy distribution from solder bumps can show substantial surface emission which has a large impact on the modeled SEU rate. State-of-the art alpha-particle detectors are required to measure the low emissivity and energy distribution.
Keywords :
alpha-particle effects; alpha-particle spectra; ion emission; surface charging; tin alloys; SnJkJk; alpha particle detectors; alpha particle emission energy spectra; emissivity measurement; energy distribution measurement; single event upset rate; solder bump materials; surface emission; Alpha particles; Ionization; Radiation detectors; Single event upset; Alpha particles; energy spectrum; ionization detectors; low-background; solder bumps;
Journal_Title :
Nuclear Science, IEEE Transactions on
DOI :
10.1109/TNS.2010.2085015
