• DocumentCode
    1394674
  • Title

    Monte Carlo Simulations to Evaluate the Contribution of Si Bulk, Interconnects, and Packaging to Alpha-Soft Error Rates in Advanced Technologies

  • Author

    Gedion, M. ; Wrobel, F. ; Saigné, F. ; Schrimpf, R.D. ; Mekki, J.

  • Author_Institution
    Univ. Montpellier II, Montpellier, France
  • Volume
    57
  • Issue
    6
  • fYear
    2010
  • Firstpage
    3121
  • Lastpage
    3126
  • Abstract
    At ground level, alpha particles are a major source of soft errors. They may result from radioactive isotopes found in electronic device materials. In this paper, the materials´ contributions to alpha particle-induced Soft Error Rate (SER) and MCU are evaluated for a 65 nm CMOS technology. The trend of SER on 45 and 32 nm is also reported in this paper. These evaluations are performed by Monte Carlo simulations, taking into account the radioactive impurity contamination levels in the device.
  • Keywords
    CMOS integrated circuits; Monte Carlo methods; alpha-particle sources; contamination; elemental semiconductors; impurities; integrated circuit interconnections; integrated circuit packaging; radioactive sources; radioisotopes; silicon; CMOS technology; Monte Carlo simulation; Si; alpha particle-induced soft error rate; electronic device materials; radioactive impurity contamination level; radioactive isotopes; Alpha particles; CMOS technology; Monte Carlo methods; Radioactive materials; Alpha particles; MC-ORACLE; bulk; interconnects; packaging; soft errors;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/TNS.2010.2085446
  • Filename
    5658041