Title :
Monte Carlo Simulations to Evaluate the Contribution of Si Bulk, Interconnects, and Packaging to Alpha-Soft Error Rates in Advanced Technologies
Author :
Gedion, M. ; Wrobel, F. ; Saigné, F. ; Schrimpf, R.D. ; Mekki, J.
Author_Institution :
Univ. Montpellier II, Montpellier, France
Abstract :
At ground level, alpha particles are a major source of soft errors. They may result from radioactive isotopes found in electronic device materials. In this paper, the materials´ contributions to alpha particle-induced Soft Error Rate (SER) and MCU are evaluated for a 65 nm CMOS technology. The trend of SER on 45 and 32 nm is also reported in this paper. These evaluations are performed by Monte Carlo simulations, taking into account the radioactive impurity contamination levels in the device.
Keywords :
CMOS integrated circuits; Monte Carlo methods; alpha-particle sources; contamination; elemental semiconductors; impurities; integrated circuit interconnections; integrated circuit packaging; radioactive sources; radioisotopes; silicon; CMOS technology; Monte Carlo simulation; Si; alpha particle-induced soft error rate; electronic device materials; radioactive impurity contamination level; radioactive isotopes; Alpha particles; CMOS technology; Monte Carlo methods; Radioactive materials; Alpha particles; MC-ORACLE; bulk; interconnects; packaging; soft errors;
Journal_Title :
Nuclear Science, IEEE Transactions on
DOI :
10.1109/TNS.2010.2085446
