DocumentCode
1395222
Title
No-Insulation (NI) Winding Technique for Premature-Quench-Free NbTi MRI Magnets
Author
Seungyong Hahn ; Dong Keun Park ; Kwangmin Kim ; Bascunan, J. ; Iwasa, Yukikazu
Author_Institution
Francis Bitter Magn. Lab., Massachusetts Inst. of Technol., Cambridge, MA, USA
Volume
22
Issue
3
fYear
2012
fDate
6/1/2012 12:00:00 AM
Firstpage
4501004
Lastpage
4501004
Abstract
This paper describes and discusses a No-Insulation (NI) winding technique that, based on experiment results of two test NbTi coils, promises to significantly improve stability and ease protection of high performance magnets; if applied to those used in marketplace MRI magnets, it may eradicate premature quenches that still afflict these magnets, though much less frequently than in the past. The key idea is that a single turn in an NI winding can, upon a quench, share the copper stabilizers of neighboring turns through turn-to-turn contacts. To demonstrate the main features of the NI technique, two test coils (Φ30 mm) were wound with insulated (INS) and no-insulation (NI) NbTi wires, respectively. The results presented in this paper include: 1) charge-discharge test results and field analyses showing that the NI field performance is essentially identical to that of the INS coil except a charging delay; and 2) charging test results where coil voltages were measured during critical current tests to imply that the NI coil is charged more stably than its INS counterpart.
Keywords
magnetic resonance imaging; magnets; winding (process); windings; charge-discharge test; coil voltage; copper stabilizers; field analysis; high performance magnets; no-insulation winding technique; premature-quench-free MRI magnets; turn-to-turn contacts; Coils; Magnetic resonance imaging; Nickel; Stability analysis; Superconducting magnets; Voltage measurement; Windings; MRI; NbTi; no-insulation; premature quench; quench-free; stability;
fLanguage
English
Journal_Title
Applied Superconductivity, IEEE Transactions on
Publisher
ieee
ISSN
1051-8223
Type
jour
DOI
10.1109/TASC.2011.2178970
Filename
6099574
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