DocumentCode :
1395263
Title :
Self-heating effects in silicon carbide MESFETs
Author :
Royet, A.S. ; Ouisse, T. ; Cabon, B. ; Noblanc, O. ; Arnodo, C. ; Brylinski, C.
Author_Institution :
Lab. de Phys. des Composants a Semicond., ENSERG, Grenoble, France
Volume :
47
Issue :
11
fYear :
2000
fDate :
11/1/2000 12:00:00 AM
Firstpage :
2221
Lastpage :
2227
Abstract :
Silicon carbide materials offer specific advantages to MESFET applications. However, to put them to good use requires to apply higher drain voltages than in GaAs devices. Therefore, in spite of the high thermal conductivity of the SiC substrates, this leads to a large power dissipation and a substantial increase in the local temperature. Depending on the device configuration, this self-heating can induce a negative differential conductance at very low frequency near dc regime. A simple analytical model is proposed, which yields a reasonable fit of the MESFET static characteristics. Further experimental evidence for such effects is also given, which corroborates the predictions of the model
Keywords :
Schottky gate field effect transistors; negative resistance; semiconductor device models; silicon compounds; wide band gap semiconductors; SiC; analytical model; negative differential conductance; power dissipation; self-heating; silicon carbide MESFET; static characteristics; thermal conductivity; Analytical models; Conducting materials; Frequency; Gallium arsenide; MESFETs; Power dissipation; Silicon carbide; Temperature; Thermal conductivity; Voltage;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.877187
Filename :
877187
Link To Document :
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