Title :
Two-Dimensional Analytical Model for Concentration Profiles of Aluminum Implanted Into 4H-SiC (0001)
Author :
Mochizuki, Kazuhiro ; Yokoyama, Natsuki
Author_Institution :
R&D Partnership for Future Power Electron. Technol., Tokyo, Japan
Abstract :
A 2-D model of aluminum-ion implantation into 4H-SiC (0001) was developed and assessed through reverse current IR-voltage VR characteristics of p-n diodes. The model was based on a Monte Carlo simulation using a binary-collision approximation. For a moderate dose (1011 - 1013 cm-2), simulated isoconcentration contours were independent of the orientation of the masking edge. This condition allowed us to extract lateral straggling by expressing the lateral-concentration profiles as a 1-D dual-Pearson distribution function multiplied by a Gaussian distribution function. To demonstrate its applicability to higher doses, the model was applied in the simulation of a 4H-SiC p-n diode whose anode was formed by a 4 × 1014 cm-2 aluminum implant into a moderately n-type doped (ND = 9 × 1015 cm-3) drift layer. The IR-VR characteristics calculated with the model were found to agree with the measured ones, suggesting that the developed model is appropriate for designing 4H-SiC power devices, including not only a p-type region with moderate aluminum implant but also a p-type region with a heavy aluminum implant on the condition that ND is sufficiently high.
Keywords :
Gaussian distribution; Monte Carlo methods; aluminium; doping profiles; ion implantation; semiconductor diodes; semiconductor doping; silicon compounds; wide band gap semiconductors; 1-D dual-Pearson distribution function; 4H-SiC p-n diode; Gaussian distribution function; Monte Carlo simulation; SiC:Al; binary-collision approximation; ion implantation; lateral-concentration profiles; n-type doped drift layer; p-type region; reverse current IR-voltage VR characteristics; two-dimensional analytical model; Aluminum; Doping; Implants; Junctions; Monte Carlo methods; Neodymium; Silicon carbide; Aluminum; ion implantation; power semiconductor devices; silicon compounds; simulation;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2010.2090527