• DocumentCode
    1395896
  • Title

    SPICE Models to Analyze Radiated and Conducted Susceptibilities of Shielded Coaxial Cables

  • Author

    Xie, Haiyan ; Wang, Jianguo ; Fan, Ruyu ; Liu, Yinong

  • Author_Institution
    Dept. of Eng. Phys., Tsinghua Univ., Beijing, China
  • Volume
    52
  • Issue
    1
  • fYear
    2010
  • Firstpage
    215
  • Lastpage
    222
  • Abstract
    This paper presents simulation program with integrated circuit emphasis (SPICE) models for the analyses of the radiated and conducted susceptibilities of shielded coaxial cables. Derived from the transmission-line equations of shielded cables, these models can be directly used for the time-domain and frequency-domain analyses, and connected to nonlinear and time-varying loads with the models already available in SPICE. In the proposed models, the usual discretization of shielded cables is not needed, and both the transfer impedance and admittance have been taken into account. Results obtained with these new models are in a good agreement with those obtained by using other approaches.
  • Keywords
    SPICE; coaxial cables; electrical engineering computing; electromagnetic shielding; frequency-domain analysis; time-domain analysis; transmission line theory; SPICE models; conducted susceptibilities; frequency domain analysis; radiated susceptibilities; shielded coaxial cables; simulation program with integrated circuit emphasis models; time domain analysis; transfer impedance; transmission line equations; Cable shielding; Coaxial cables; Frequency domain analysis; Impedance; Integrated circuit modeling; Load modeling; Nonlinear equations; SPICE; Time domain analysis; Transmission lines; Conducted susceptibility; multiconductor transmission line; radiated susceptibility; shielded coaxial cables; simulation program with integrated circuit emphasis (SPICE) model;
  • fLanguage
    English
  • Journal_Title
    Electromagnetic Compatibility, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9375
  • Type

    jour

  • DOI
    10.1109/TEMC.2009.2036929
  • Filename
    5398907