DocumentCode :
1395952
Title :
A Novel Partial-Ground-Plane-Based MOSFET on Selective Buried Oxide: 2-D Simulation Study
Author :
Loan, Sajad A. ; Qureshi, S. ; Iyer, S. Sundar Kumar
Author_Institution :
Dept. of Electr. Eng., Indian Inst. of Technol. Kanpur, Kanpur, India
Volume :
57
Issue :
3
fYear :
2010
fDate :
3/1/2010 12:00:00 AM
Firstpage :
671
Lastpage :
680
Abstract :
A novel partial-ground-plane (PGP)-based MOSFET on a selective buried oxide (SELBOX), named PGP-SELBOX, is proposed. An extensive simulation study and the comparative analysis of the key characteristics of the PGP-SELBOX, the SELBOX, and the conventional silicon-on-insulator (SOI) devices has been performed using the 2-D device simulator Medici. The simulations have revealed that the PGP-SELBOX and the SELBOX structures are more thermally efficient than the conventional SOI device. Further, the magnitude of the short-channel effects (SCEs) is lower in the PGP-SELBOX in comparison to the SELBOX device. Though the SCE suppression is best in the thin-film SOI device, the PGP-SELBOX shows better improvement in SCE suppression in comparison to the SELBOX device. The suppression of self-heating effects and SCEs in the PGP-SELBOX results in a significant reduction in leakage current. An improved performance in terms of I ON/I OFF ratio is obtained in the PGP-SELBOX device. Further, the fT values of the PGP-SELBOX are comparable to those of the SELBOX and the SOI devices. A process flow in which a low-dose separation by implantation of oxygen technique can be employed for the fabrication of the PGP-SELBOX is also proposed.
Keywords :
MOSFET; electronic engineering computing; silicon-on-insulator; 2D simulation study; partial-ground-plane-based MOSFET; selective buried oxide; self-heating effect suppression; short-channel effects; silicon-on-insulator devices; thin film SOI device; Analytical models; Degradation; Fabrication; Isolation technology; Leakage current; MOSFET circuits; Medical simulation; Semiconductor thin films; Silicon on insulator technology; Thermal conductivity; Ground plane (GP); leakage current; self-heating effects; short-channel effects (SCEs); silicon-on-insulator (SOI); subthreshold slope; thermal analysis;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2009.2039545
Filename :
5398916
Link To Document :
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