DocumentCode
1396165
Title
Hollow Out-of-Plane Polymer Microneedles Made by Solvent Casting for Transdermal Drug Delivery
Author
Mansoor, Iman ; Häfeli, Urs O. ; Stoeber, Boris
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of British Columbia, Vancouver, BC, Canada
Volume
21
Issue
1
fYear
2012
Firstpage
44
Lastpage
52
Abstract
Although hollow microneedles have been proposed as an effective and convenient method for transdermal drug delivery, their expensive fabrication techniques to date have prevented their mass fabrication as a viable option. A novel method, based on solvent casting, is presented for inexpensive fabrication of hollow out-of-plane polymer microneedles. Microneedles are formed during a solvent evaporation process, which leaves a polymer layer around pillars in a prefabricated mold. The mold is fabricated using photolithography and can be used for consecutive solvent casting of microneedles. Arrays of microneedles with lengths up to 250 μm have been fabricated from clay-reinforced polyimide. Several mechanical tests were performed on solvent cast solid structures to find the optimum clay percentage in the polyimide that would lead to the highest compressive strength. The fabricated needles were tested for robustness, and it was observed that the needles were capable of withstanding on average compressive loads of up to 0.32 N. The suitability of the microneedles for skin penetration and drug delivery was demonstrated by injection of fluorescent beads into a skin sample.
Keywords
biomedical equipment; casting; compressive strength; drugs; needles; photolithography; polymers; skin; clay-reinforced polyimide; compressive loads; compressive strength; microneedle arrays; mold; photolithography; polymer microneedles; skin; solvent casting; solvent evaporation; transdermal drug delivery; Casting; Fabrication; Needles; Polyimides; Skin; Solvents; BioMEMS; drug delivery; hollow out-of-plane polymer microneedles; solvent-cast microstructures;
fLanguage
English
Journal_Title
Microelectromechanical Systems, Journal of
Publisher
ieee
ISSN
1057-7157
Type
jour
DOI
10.1109/JMEMS.2011.2174429
Filename
6101546
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