• DocumentCode
    1396303
  • Title

    Analysis of Interaction Structure Among Multiple Functional Process Variables for Process Control in Semiconductor Manufacturing

  • Author

    Zhang, Xi ; Huang, Qiang

  • Author_Institution
    Dept. of Ind. Manage. & Syst. Eng., Univ. of South Florida, Tampa, FL, USA
  • Volume
    23
  • Issue
    2
  • fYear
    2010
  • fDate
    5/1/2010 12:00:00 AM
  • Firstpage
    263
  • Lastpage
    272
  • Abstract
    Our previous work has shown that complex interaction patterns among functional process variables (FPVs) in semiconductor manufacturing processes can indicate process condition changes. We developed a nonlinear dynamics model to describe interactions among FPVs, which was further used to monitor process condition changes. However, the interaction structure among three or more FPVs has not been thoroughly investigated for the purpose of process control. In this work, we first extend our previously developed nonlinear dynamics model by considering the autocorrelation in each FPV. A generalized least square (GLS) method is applied to estimate the extended model. The interaction structure among FPVs is represented as a complex network in which the directionality and strength of interaction are discovered from the extended nonlinear dynamics model. To validate the proposed method, we first conduct simulation study using van del Pol oscillators. Then two sets of real experimental data from chemical mechanical planarization process are used to investigate the interaction structure change over a polishing cycle. The results show that the extracted patterns of interaction structure among FPVs aid to uncover the polishing mechanisms and provide more insights for condition monitoring and diagnosis.
  • Keywords
    chemical mechanical polishing; least squares approximations; nonlinear dynamical systems; semiconductor process modelling; chemical mechanical planarization process; complex interaction pattern; condition monitoring; generalized least square method; interaction structure; multiple functional process variables; nonlinear dynamics model; polishing mechanisms; process control; semiconductor manufacturing process; Correlation pattern; interaction; multichannel signals; network; process monitoring;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/TSM.2010.2041580
  • Filename
    5398969