DocumentCode :
1396303
Title :
Analysis of Interaction Structure Among Multiple Functional Process Variables for Process Control in Semiconductor Manufacturing
Author :
Zhang, Xi ; Huang, Qiang
Author_Institution :
Dept. of Ind. Manage. & Syst. Eng., Univ. of South Florida, Tampa, FL, USA
Volume :
23
Issue :
2
fYear :
2010
fDate :
5/1/2010 12:00:00 AM
Firstpage :
263
Lastpage :
272
Abstract :
Our previous work has shown that complex interaction patterns among functional process variables (FPVs) in semiconductor manufacturing processes can indicate process condition changes. We developed a nonlinear dynamics model to describe interactions among FPVs, which was further used to monitor process condition changes. However, the interaction structure among three or more FPVs has not been thoroughly investigated for the purpose of process control. In this work, we first extend our previously developed nonlinear dynamics model by considering the autocorrelation in each FPV. A generalized least square (GLS) method is applied to estimate the extended model. The interaction structure among FPVs is represented as a complex network in which the directionality and strength of interaction are discovered from the extended nonlinear dynamics model. To validate the proposed method, we first conduct simulation study using van del Pol oscillators. Then two sets of real experimental data from chemical mechanical planarization process are used to investigate the interaction structure change over a polishing cycle. The results show that the extracted patterns of interaction structure among FPVs aid to uncover the polishing mechanisms and provide more insights for condition monitoring and diagnosis.
Keywords :
chemical mechanical polishing; least squares approximations; nonlinear dynamical systems; semiconductor process modelling; chemical mechanical planarization process; complex interaction pattern; condition monitoring; generalized least square method; interaction structure; multiple functional process variables; nonlinear dynamics model; polishing mechanisms; process control; semiconductor manufacturing process; Correlation pattern; interaction; multichannel signals; network; process monitoring;
fLanguage :
English
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
0894-6507
Type :
jour
DOI :
10.1109/TSM.2010.2041580
Filename :
5398969
Link To Document :
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