DocumentCode :
1397326
Title :
In-Plane Biocompatible Microfluidic Interconnects for Implantable Microsystems
Author :
Johnson, D.G. ; Frisina, R.D. ; Borkholder, D.A.
Author_Institution :
Rochester Inst. of Technol., Rochester, NY, USA
Volume :
58
Issue :
4
fYear :
2011
fDate :
4/1/2011 12:00:00 AM
Firstpage :
943
Lastpage :
948
Abstract :
Small mammals, particularly mice, are very useful animal models for biomedical research. Extremely small anatomical dimensions, however, make design of implantable microsystems quite challenging. A method for coupling external fluidic systems to microfluidic channels via in-plane interconnects is presented. Capillary tubing is inserted into channels etched in the surface of a Si wafer with a seal created by Parylene-C deposition. Prediction of Parylene-C deposition into tapered channels based on Knudsen diffusion and deposition characterizations allows for design optimization. Low-volume interconnects using biocompatible, chemical resistant materials have been demonstrated and shown to withstand pressure as high as 827 kPa (120 psi) with an average pull test strength of 2.9 N. Each interconnect consumes less than 0.018 mm3 (18 nL) of volume. The low added volume makes this an ideal interconnect technology for medical applications where implant volume is critical.
Keywords :
Knudsen flow; bioMEMS; biomedical materials; microchannel flow; prosthetics; vapour deposition; Knudsen diffusion; biocompatible microfluidic interconnects; capillary tubing; implantable microsystems; in-plane interconnects; microfluidic channels; parylene-c deposition; pull test strength; Channel estimation; Microchannel; Microfluidics; Plastics; Polyimides; Silicon; Implantable biomedical devices; Parylene-C; microfluidic interconnections; vapor deposition; Animals; Biocompatible Materials; Equipment Design; Equipment Failure Analysis; Humans; Mice; Microfluidic Analytical Techniques; Miniaturization; Prostheses and Implants;
fLanguage :
English
Journal_Title :
Biomedical Engineering, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9294
Type :
jour
DOI :
10.1109/TBME.2010.2098031
Filename :
5659892
Link To Document :
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