• DocumentCode
    139791
  • Title

    Fabrication of flexible microlens array through vapor-induced room temperature dewetting on plasma treated Parylene-C

  • Author

    Xiaopeng Bi ; Wen Li

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Michigan State Univ., East Lansing, MI, USA
  • fYear
    2014
  • fDate
    26-30 Aug. 2014
  • Firstpage
    2085
  • Lastpage
    2088
  • Abstract
    Microlens arrays have been widely used as an essential component in many optical systems. The conventional fabrication techniques, such as ink-jet printing, photoresist thermal reflow, grayscale photolithography, and LIGA process have some drawbacks in aspects of process complexity and high fabrication cost. This paper presents a low-temperature, rapid and cost-effective method to successfully generate SU-8 microlens arrays on biocompatible Parylene-C surfaces. Vapor-induced SU-8 dewetting has been achieved on chemically modified Parylene-C surfaces that were selectively pre-treated with O2 or SF6 plasma. By this technique, the SU-8 droplets are self-organized onto desired positions to form a microlens array. This method is also suitable for production of microlens array on curved surfaces. The progress of dewetting has been studied by both experiment and simulation.
  • Keywords
    drops; microfabrication; microlenses; optical arrays; optical fabrication; optical polymers; oxygen; self-assembly; sulphur compounds; wetting; LIGA process; O2; SF6; SU-8 droplet self-organization; SU-8 microlens array fabrication; chemically modified parylene-C surfaces; grayscale photolithography; ink-jet printing; optical systems; oxygen plasma treated parylene-C surfaces; photoresist thermal reflow; sulfur hexafluoride plasma treated parylene-C surfaces; temperature 293 K to 298 K; vapor-induced room temperature dewetting; Arrays; Fabrication; Lenses; Microoptics; Plasmas; Resists; Surface treatment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society (EMBC), 2014 36th Annual International Conference of the IEEE
  • Conference_Location
    Chicago, IL
  • ISSN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/EMBC.2014.6944027
  • Filename
    6944027