• DocumentCode
    1398137
  • Title

    Thermoelectric Characterization and Power Generation Using a Silicon-on-Insulator Substrate

  • Author

    Lee, Jaeho ; Kim, SangBum ; Marconnet, Amy ; Zandt, M. A A in´t ; Asheghi, Mehdi ; Wong, H. -S Philip ; Goodson, Kenneth E.

  • Author_Institution
    Dept. of Mech. Eng., Stanford Univ., Stanford, CA, USA
  • Volume
    21
  • Issue
    1
  • fYear
    2012
  • Firstpage
    4
  • Lastpage
    6
  • Abstract
    We demonstrate techniques for measuring thermoelectric voltages and generating on-chip power using a silicon-on-insulator substrate. Our design uses lateral heat conduction in the silicon overlayer to establish temperature gradients, which dramatically reduces microfabrication complexity compared to competing designs based on a free-standing membrane. This letter characterizes the thermoelectric power of a metal-semiconductor structure involving a doped SbTe alloy that is relevant for phase-change memory. The thermoelectric power of the SbTe-TiW thermocouple is 24 μV/K, and the power generation output achieves up to 0.56 μW/cm2 with a temperature gradient of 18°K.
  • Keywords
    antimony compounds; microfabrication; phase change memories; semiconductor-metal boundaries; silicon-on-insulator; substrates; thermocouples; thermoelectric conversion; thermoelectric power; titanium alloys; tungsten alloys; voltage measurement; SbTe-TiW-Si; doped alloy; free-standing membrane; lateral heat conduction; metal-semiconductor structure; microfabrication complexity reduction; on-chip power generation; phase-change memory; silicon-on-insulator substrate; temperature 18 K; temperature gradient; thermoelectric characterization; thermoelectric power; thermoelectric voltage measurement; Heating; Junctions; Silicon; Substrates; Temperature measurement; Voltage measurement; On-chip power generation; SbTe; Seebeck coefficient measurement; silicon-on-insulator (SOI); thermoelectric power generation (TEG);
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2011.2175704
  • Filename
    6104089