DocumentCode :
1398137
Title :
Thermoelectric Characterization and Power Generation Using a Silicon-on-Insulator Substrate
Author :
Lee, Jaeho ; Kim, SangBum ; Marconnet, Amy ; Zandt, M. A A in´t ; Asheghi, Mehdi ; Wong, H. -S Philip ; Goodson, Kenneth E.
Author_Institution :
Dept. of Mech. Eng., Stanford Univ., Stanford, CA, USA
Volume :
21
Issue :
1
fYear :
2012
Firstpage :
4
Lastpage :
6
Abstract :
We demonstrate techniques for measuring thermoelectric voltages and generating on-chip power using a silicon-on-insulator substrate. Our design uses lateral heat conduction in the silicon overlayer to establish temperature gradients, which dramatically reduces microfabrication complexity compared to competing designs based on a free-standing membrane. This letter characterizes the thermoelectric power of a metal-semiconductor structure involving a doped SbTe alloy that is relevant for phase-change memory. The thermoelectric power of the SbTe-TiW thermocouple is 24 μV/K, and the power generation output achieves up to 0.56 μW/cm2 with a temperature gradient of 18°K.
Keywords :
antimony compounds; microfabrication; phase change memories; semiconductor-metal boundaries; silicon-on-insulator; substrates; thermocouples; thermoelectric conversion; thermoelectric power; titanium alloys; tungsten alloys; voltage measurement; SbTe-TiW-Si; doped alloy; free-standing membrane; lateral heat conduction; metal-semiconductor structure; microfabrication complexity reduction; on-chip power generation; phase-change memory; silicon-on-insulator substrate; temperature 18 K; temperature gradient; thermoelectric characterization; thermoelectric power; thermoelectric voltage measurement; Heating; Junctions; Silicon; Substrates; Temperature measurement; Voltage measurement; On-chip power generation; SbTe; Seebeck coefficient measurement; silicon-on-insulator (SOI); thermoelectric power generation (TEG);
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/JMEMS.2011.2175704
Filename :
6104089
Link To Document :
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