Title :
AlGaN/GaN HEMT With 300-GHz
Author :
Chung, Jinwook W. ; Hoke, William E. ; Chumbes, Eduardo M. ; Palacios, TomÁs
Author_Institution :
Microsyst. Technol. Labs., Massachusetts Inst. of Technol., Cambridge, MA, USA
fDate :
3/1/2010 12:00:00 AM
Abstract :
We report on a gate-recessed AlGaN/GaN high-electron mobility transistor (HEMT) on a SiC substrate with a record power-gain cutoff frequency (fmax). To achieve this high fmax, we combined a low-damage gate-recess technology, scaled device geometry, and recessed source/drain ohmic contacts to simultaneously enable minimum short-channel effects (i.e., high output resistance Rds) and very low parasitic resistances. A 60-nm-gate-length HEMT with recessed AlGaN barrier exhibited excellent Rds of 95.7 ????mm, Ron of 1.1 ~ 1.2 ?? ?? mm, and fmax of 300 GHz, with a breakdown voltage of ~ 20 V. To the authors´ knowledge, the obtained fmax is the highest reported to date for any nitride transistor. The accuracy of the fmax value is verified by small signal modeling based on carefully extracted S-parameters.
Keywords :
III-V semiconductors; aluminium compounds; gallium compounds; geometry; high electron mobility transistors; ohmic contacts; silicon compounds; wide band gap semiconductors; AlGaN-GaN; HEMT; SiC; SiC substrate; frequency 300 GHz; high-electron mobility transistor; low-damage gate-recess technology; nitride transistor; recessed source/drain ohmic contacts; scaled device geometry; short-channel effects; size 60 nm; AlGaN; GaN; SiC substrate; gate recess; high-electron mobility transistor (HEMT); maximum oscillation frequency $(f_{ max})$; recessed ohmic; short-channel effects;
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/LED.2009.2038935