DocumentCode
139877
Title
On verification of splines based intraoperative reconstruction of cardiac anatomy: Model research
Author
Yifan Fu ; Jian Wu
Author_Institution
Grad. Sch. at Shenzhen, Tsinghua Univ., Shenzhen, China
fYear
2014
fDate
26-30 Aug. 2014
Firstpage
2436
Lastpage
2439
Abstract
Three-dimensional (3D) endocardium visualization plays an extremely important role in localization and ablation of target areas and can improve the cure rate in computer-aided cardiac surgery. In this paper, we discuss how to reconstruct and update the corresponding endocardium surface model quickly and accurately based on the sparse point cloud that is collected dynamically on the left atrial intima. Firstly, we construct a specific mesh model, and then collect spatial points, and carried out the mesh grid approximation based on Thin Plate Splines (TPS) intra-operatively, finally, we obtained an approximate target shape after Taubin-based smooth. Experiments on four left atriums´ (LA) CT Angiographies (CTA) demonstrated that the reconstructed surfaces can well fit to the target shape, the distance error of surface between the reconstructed and targets can meet clinical requirements, and the deformation time can also meet the need of real-time update. The results showed that our proposed method is robust, fast and flexible to implement.
Keywords
angiocardiography; computerised tomography; medical computing; splines (mathematics); surgery; 3D endocardium visualization; CT angiographies; CTA; Taubin-based smooth; cardiac anatomy; computer-aided cardiac surgery; endocardium surface model; left atrial intima; left atriums; mesh grid approximation; reconstructed surfaces; sparse point cloud; splines based intraoperative reconstruction; thin plate splines; Approximation methods; Deformable models; Image reconstruction; Shape; Surface reconstruction; Surgery; Three-dimensional displays;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society (EMBC), 2014 36th Annual International Conference of the IEEE
Conference_Location
Chicago, IL
ISSN
1557-170X
Type
conf
DOI
10.1109/EMBC.2014.6944114
Filename
6944114
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