DocumentCode :
139880
Title :
Design of an intra-operative imaging system for the cochlear implant
Author :
Klafas, Calla ; McEwan, Alistair ; Carter, Paul
Author_Institution :
Sch. of Electr. & Inf. Eng., Univ. of Sydney, Sydney, NSW, Australia
fYear :
2014
fDate :
26-30 Aug. 2014
Firstpage :
2448
Lastpage :
2451
Abstract :
Research has shown that closer proximity of a cochlear implant electrode array to the inner modiolar wall can improve hearing performance in a recipient. It is understood that developing a real-time intra-operative imaging technique would bring the surgeon visual feedback that can correlate with tactile resistances during electrode insertion, reducing various risks of insertion traumas, while guiding the electrode for optimal placement. This paper presents the design of a 3-dimensional magnetic imaging system which provides a means for real-time imaging by reconstructing uniform segments of the electrode array´s contours. In addition, the theoretical error of this reconstruction method is evaluated to select an optimal number of sensors within the electrode design. The theoretical error of the reconstruction method is evaluated for 7 to 22 inductive sensors within the electrode design. For 16 or more sensors, the error is improves to less than 0.5%. A working prototype was confirmed on a 10:1 scale with orthogonal Helmholtz coils at 85-115kHz.
Keywords :
biomedical MRI; biomedical electrodes; cochlear implants; coils; hearing; inductive sensors; cochlear implant electrode array; frequency 85 kHz to 115 kHz; hearing performance; inductive sensors; inner modiolar wall; insertion trauma risk reduction; intraoperative imaging system; orthogonal Helmholtz coils; real-time intra-operative imaging technique; surgeon visual feedback; tactile resistances; three-dimensional magnetic imaging system; Coils; Electrodes; Magnetic sensors; Sensor arrays; Vectors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2014 36th Annual International Conference of the IEEE
Conference_Location :
Chicago, IL
ISSN :
1557-170X
Type :
conf
DOI :
10.1109/EMBC.2014.6944117
Filename :
6944117
Link To Document :
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