Title :
Cold pressure-welding and its influence on device design and manufacture
Author :
Boswell, D. ; Humphrey, R.
fDate :
5/1/1959 12:00:00 AM
Abstract :
A brief discussion of the effects of cold welding on container design is followed by considerations of tool design and an assessment of the process on a production scale. Surface preparation and component dimensional control are prime considerations.
Keywords :
semiconductor devices; welding;
Journal_Title :
Proceedings of the IEE - Part B: Electronic and Communication Engineering
DOI :
10.1049/pi-b-2.1959.0098
