Title :
Ultralow Power 80 Gb/s Arrayed CMOS Silicon Photonic Transceivers for WDM Optical Links
Author :
Zheng, Xuezhe ; Liu, Frankie Y. ; Lexau, Jon ; Patil, Dinesh ; Li, Guoliang ; Luo, Ying ; Thacker, Hiren D. ; Shubin, Ivan ; Yao, Jin ; Raj, Kannan ; Ho, Ron ; Cunningham, John E. ; Krishnamoorthy, Ashok V.
Author_Institution :
Oracle Labs., San Diego, CA, USA
Abstract :
Silicon photonic interconnects offer a promising solution to meeting the ever growing demand for more efficient I/O bandwidth density. We report an ultralow power 80 Gb/s arrayed silicon photonic transceiver for dense, large bandwidth inter/intrachip interconnects. Low parasitic microsolder-based hybrid bonding enables close integration of silicon photonic array devices optimized on a 130 nm silicon-on-insulator CMOS platform with CMOS very large scale integration circuits optimized on a 40 nm silicon CMOS platform to achieve unprecedented energy efficiency. The hybrid CMOS transceiver consists of eight 10 Gb/s channels with a total consumed power below 6 mW/channel. The eight-channel wavelength division multiplexing transmitter array using cascaded tunable ring modulators demonstrated better than 100 fJ/bit energy efficiency for 10 Gb/s operation excluding the laser power and tuning power, while the eight-channel receiver array using broadband Ge p-i-n waveguide detectors show sensitivity of better than -15 dBm for a bit error rate of 10-12 at a data rate of 10 Gb/s with energy efficiency of better than 500 fJ/bit.
Keywords :
CMOS integrated circuits; error statistics; integrated circuit interconnections; optical links; optical modulation; optical transceivers; silicon-on-insulator; telecommunication channels; wavelength division multiplexing; CMOS very large scale integration circuits; WDM optical links; bit error rate; bit rate 10 Gbit/s; bit rate 80 Gbit/s; broadband p-i-n waveguide detectors; cascaded tunable ring modulators; eight-channel receiver array; eight-channel wavelength division multiplexing transmitter array; hybrid CMOS transceiver; interchip interconnects; intrachip interconnects; low parasitic microsolder-based hybrid bonding; silicon photonic array devices; silicon photonic interconnects; silicon-on-insulator CMOS platform; size 130 nm; size 40 nm; ultralow power arrayed CMOS silicon photonic transceivers; unprecedented energy efficiency; Arrays; Modulation; Optical waveguides; Photonics; Receivers; Silicon; Wavelength division multiplexing; Optical communications; optical interconnections; optical receivers; optical transmitters; silicon photonics; transceiver array;
Journal_Title :
Lightwave Technology, Journal of
DOI :
10.1109/JLT.2011.2179287