DocumentCode :
1400280
Title :
Inductance in VLSI interconnection modelling
Author :
Moll, F. ; Roca, M. ; Rubio, A.
Author_Institution :
Dept. of Electron. Eng., Univ. Politecnica de Catalunya, Barcelona, Spain
Volume :
145
Issue :
3
fYear :
1998
fDate :
6/1/1998 12:00:00 AM
Firstpage :
175
Lastpage :
179
Abstract :
The present trend of increasing speed of operation in integrated circuits may produce transmission line effects in the interconnections. To decide whether these effects are important and should be taken into account in the interconnection modelling, an evaluation of characteristic impedance and signal time propagation is needed. These two parameters are calculated from capacitance and inductance values obtained by simulation using an industrial software tool. Typical VLSI interconnection dimensions are considered, studying the influence of design variables (distance between lines and length) on the values obtained. The relative magnitude of these parameters has an effect on which interconnect model best suits a certain interconnection. Ranges of validity of the different models are given for typical cases
Keywords :
VLSI; inductance; integrated circuit interconnections; integrated circuit modelling; VLSI interconnection modelling; characteristic impedance; inductance; integrated circuit; signal time propagation; simulation; transmission line;
fLanguage :
English
Journal_Title :
Circuits, Devices and Systems, IEE Proceedings -
Publisher :
iet
ISSN :
1350-2409
Type :
jour
DOI :
10.1049/ip-cds:19981859
Filename :
694944
Link To Document :
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