DocumentCode
1400767
Title
Some trends in the use of epoxide resins in electronic engineering
Author
Powell, G.J. ; Stolton, R.E.
Volume
109
Issue
21
fYear
1962
fDate
5/15/1905 12:00:00 AM
Firstpage
281
Lastpage
285
Abstract
Various means of modifying liquid epoxide-resin systems to adapt them for specific uses are illustrated. The use of coal tar as a cheap diluent is described and its effects on some electrical properties of two typical epoxide-resin compositions are shown. Some mechanical and electrical properties of systems containing a new flexible diepoxide resin are indicated. Such systems are of potential interest for the encapsulation of components where good resistance to moderate temperatures and thermal shock is required. The results of the formulation of doughs and powders from liquid epoxide-resin systems are shown by reference to dough moulding compositions, moulding powders and powders for application by the fluidized-bed technique.
Keywords
electronic equipment; instrumentation; plastics;
fLanguage
English
Journal_Title
Proceedings of the IEE - Part B: Electronic and Communication Engineering
Publisher
iet
ISSN
0369-8890
Type
jour
DOI
10.1049/pi-b-2.1962.0050
Filename
5244605
Link To Document