DocumentCode :
140096
Title :
Motion artifact reduction in PPG signals from face: Face tracking & stochastic state space modeling approach
Author :
Chankyu Park ; Ho-Jin Choi
Author_Institution :
Dept. of Intell. Cognitive Res., Electron. Telecommun. Res. Inst., Daejeon, South Korea
fYear :
2014
fDate :
26-30 Aug. 2014
Firstpage :
3280
Lastpage :
3283
Abstract :
The Photoplethymography(PPG) is generally measured on a finger or an ear using contact sensors. The recent several studies using non-contact sensor such as CCD camera and web-cam to measure PPG have been introduced. However the motion artifact issue is also emerging in non-contact camera sensing similar to contact-type one because it is sensitive to artifacts generated by subject´s head and body motion. In this paper, the two sequential approaches for a motion artifact reduction algorithm are presented; the one is a face tracking method that detects and tracks the skin region of face which is containing PPG signals, the other is the reduction method of motion artifact due to various head & face movement such as roll, yaw, pitch, translation and scale. Results of the proposed KF are compared to these of the FIR band pass filter(BPF).
Keywords :
CCD image sensors; FIR filters; band-pass filters; biomechanics; face recognition; medical signal detection; photoplethysmography; signal denoising; skin; stochastic processes; BPF; CCD camera; FIR band pass filter; PPG signals; body motion; contact-type sensor; ear; face skin region detection; face skin region tracking; face tracking method; finger; head & face movement; head motion; motion artifact reduction algorithm; noncontact camera sensing; noncontact sensor; photoplethymography; pitch; reduction method; roll; scale; stochastic state space modeling approach; translation; web-cam; yaw; Band-pass filters; Cameras; Computational modeling; Face; Fetal heart rate; Kalman filters; Sensors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2014 36th Annual International Conference of the IEEE
Conference_Location :
Chicago, IL
ISSN :
1557-170X
Type :
conf
DOI :
10.1109/EMBC.2014.6944323
Filename :
6944323
Link To Document :
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